Technology
R&D

Technology

20
Development of epoxy molding material for GIS Spacer APG (first in Korea) Development period : 2019. 10 ~ 2021. 10
  • Development of replacing solid resin for spacer molding with liquid resin
  • Improved productivity and workability
  • Excellent heat resistance (Tg 125 or higher) and crack resistance
  • Excellent electrical properties and mechanical strength
19
Development of resin mortar epoxy for the floor of railway Development period : 2019. 02 ~ 2020. 02
  • Mixing ratio 2:1, 3:1 2type development
  • Excellent horizontal leveling
  • Excellent abrasive workability
  • Hardness 70D
18
Development of winding resin and conductive coating material for FRP CORE Development period : 2017. 09 ~ 2018. 09
  • Excellent conductivity
  • Excellent glass fiber impregnation
  • Excellent abrasive workability
17
Development of condenser bushing molding material for 154kV ultra high pressure transformer Development period :2013. ~ 2016.
  • Development of Condenser Bushing Localization for Ultra High Pressure Transformer
  • Excellent impregnation, thermal resistance, crack resistance
  • Excellent electrical characteristics and mechanical strength
16
Complex material for smartphones and laptops Development period : 2010. ~ 2012.
  • Low chlorine, eco friendly (under 900ppm)
  • Excellent weatherability
  • Excellent formability
15
Development of molding material for ultra high pressure SIS Development period : 2018. ~ 2010.
  • Tg 140℃ or higher
  • No shrinkage during molding
  • Excellent weatherability and tracking resistivity
  • No abnormality in long-term reliability test
14
Development of ultra high pressure auto molding material Development period :
  • 2008. ~ 2011.
    • Development of ultra-high pressure APG for large GIS
    • Less shrinkage during molding
    • Excellent mechanical strength withstand voltage
    • Excellent flowability
    • 13
    Applied patent for high insulation high heat resistance epoxy (No.10-0923929) Development period : 2005. ~ 2008.
    • Ultra high pressure molding material for ultra large GIS
    • No shrinkage during molding
    • Excellent mechanical strength and physical properties
    • Excellent electrical insulation properties
    12
    Underground switchgear molding material Development period : 2003. ~ 2006.
    • Tg 120℃ or higher
    • No shrinkage during molding
    • Excellent tracking resistivity
    • Excellent electrical insulation properties
    11
    Development of high reliability outdoor epoxy (No.10-0622551) Development period : 2003. ~2005.
    • Ultra high pressure molding material for ECO ground switch and circuit breaker
    • Excellent outdoor stability
    • Excellent outdoor water repellency and excellent tracking resistivity
    10
    Extra high pressure heavy electric molding material Development period : 2000. 06~ 2001. 02.
    • Development of products that replace imported products of HUNTSMAN
    • No insulation loss under high pressure
    • Minimize hardening stress change during molding
    • Excellent electrical, mechanical properties and tracking resistivity
    • Due to the long pot life, APG injection are excellent
    • Import substitution effect : 15billion / year
    09
    Ultra high GIS molding material Development period : 2000. 03 ~ 2002. 07
    • Insulation parts used for power transmission and distribution
    • Excellent chemical resistance, sealing and gas tightness for GIS gas
    • Excellent insulation durability in repeated electric shock under ultra high voltage
    • Excellent resistance to repeated stress changes under adverse conditions
    08
    Potential transformercCasting material Development period : 2000. 08. ~ 2001. 03.
    • Excellent insulation durability and high impregnation of high capacity fine coil
    • Minimize insulation loss under high voltage
    • Perfect impregnation with one mold without varnish
    • Excellent durability under repeated impact and high voltage
    07
    High-performance bushing molding material Development period : 2001. 03. ~ 2002. 02.
    • Extra high pressure molding material for ultra low shrinkage APG
    • Molding shrinkage rate within 2% when forming a large insulation material
    • Excellent electrical properties and minimal insulation loss
    06
    Development of resin for high performance vessel filament winding Development period : 2001. 05. ~ 2002. 09.
    • Excellent heat resistance and electrical insulation
    • Excellent mechanical properties
    • Excellent heat resistance (Tg 175℃)
    05
    For high performance rail adhesion Development period : 2001. 08. ~ 2002. 04.
    • Localization of imported products
    • Secure high reliability adhesion to repeated vibration and thermal shock
    • Excellent adhesion (280 Kg / ㎠)
    04
    Development of power semiconductor potting material Development period : 2000. 07. ~ 2002. 08.
    • Localization of imported products
    • Excellent durability under adverse conditions
    • Minimization of characteristic changes in repeated impulse withstand voltage
    • Minimize shrinkage during molding
    03
    Development of high strength prepreg material Development period : 2000. 03. ~ 2001. 09.
    • No physical shrinkage and excellent physical properties
    • Excellent electrical insulation properties and moldability
    02
    Development of outdoor molding material and casting resin Development period : 2000. 02. ~ 2001. 04.
    • Ultra high stability and excellent formability
    • Excellent electrical properties such as ARC, corona discharge and withstand voltage
    • Minimize shrinkage when molding large insulators
    01
    Other technologies and applications
    • Adhesion improvement technology according to each carbon fiber condition
    • Synthesis technology of high strength curing agent for civil construction
    • Modified denaturation technology to minimize shrinkage
    • Shortening of molding time technology during pultrusion
    • Stress change analysis and control technology in reaction
    • Epoxy multifunctional synthesis technology
    • Exothermic control technology during epoxy reaction
    • Acid anhydride modification and low Tg synthesis technology